Specifications

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Specifications

 ME-500ME-650
X-Y
Axes
Engraving Area 483 x 305mm
(19.0 x 12.0")
650 x 440mm
(25.6 x 17.3")
SpeedEngraving 0.5-50mm/sec (0.02-2.0"/sec)
Moving 20-80mm/sec (0.8-3.1"/sec)
AccelerationEngraving 0.05G
Moving 0.3G
Mechanical Resolution 0.5μm
Z-
Axis
Maximum Z stroke 60mm (2.4")
SpeedEngraving 0.5-10mm/sec (0.02-0.4"/sec)
Moving 5-30mm/sec (0.2-1.2"/sec)
AccelerationEngraving 0.05G
Moving 0.3G
Mechanical Resolution 0.25μm
Command Resolution 10, 25μm
Spindle Rotation 7000-14000rpm
Spindle Diameter 6mm(0.24"), 3mm(0.11") optional
Maximum Material Weight 20kg (44lbs)
Command MGL-IIC3 (HP-GL*1 based)
Receiver Buffer Size 1MB
Interface RS-232C
Flatness 0.2mm
Distance Accuracy 0.1mm/300mm
Perpendicularity ±0.3mm/300mm
Repetition Accuracy 0.05mm
Origin Repetition Accuracy ±0.2mm
Power Requirement AC100, 120, 220, 240V Factory preset
50/60Hz
Power Consumption 350VA or less
Operating
Environment
Temperature 5-40ºC
Humidity 35-75% (Rh) No condensation
Dimensions (W x D x H) 785 x 730 x 510mm
(30.9 x 28.7 x 20.1")
880 x 940 x 510mm
(34.6 x 37.0 x 20.1")
Weight 80kg (177lbs) 95kg (210lbs)
  • *1 HP-GL is a trademark of Hewlett-Packard Co.
  • The specifications are subject to change without prior notice.

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